Follow
Krzysztof Nieweglowski
Krzysztof Nieweglowski
Technische Universität Dresden, Institute of Electronic Packaging Technology
Verified email at tu-dresden.de - Homepage
Title
Cited by
Cited by
Year
Design and optimization of planar multimode waveguides for high speed board-level optical interconnects
K Nieweglowski, R Rieske, S Sohr, KJ Wolter
2013 IEEE 63rd Electronic Components and Technology Conference, 1898-1904, 2013
212013
Energy-efficient transceivers for ultra-highspeed computer board-to-board communication
M Jenning, B Klein, R Hahnel, D Plettemeier, D Fritsche, G Tretter, ...
2015 IEEE International Conference on Ubiquitous Wireless Broadband (ICUWB), 1-5, 2015
202015
Demonstration of board-level optical link with ceramic optoelectronic multi-chip module
K Nieweglowski, R Rieske, KJ Wolter
2009 59th Electronic Components and Technology Conference, 1879-1886, 2009
162009
Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems
K Nieweglowski, L Lorenz, S Lüngen, T Tiedje, KJ Wolter, K Bock
Microelectronics Reliability 84, 121-126, 2018
152018
Asymmetric optical bus coupler for interruption-free short-range connections on board and module level
L Lorenz, K Nieweglowski, Z Al-Husseini, N Neumann, D Plettemeier, ...
Journal of Lightwave Technology 35 (18), 4033-4039, 2017
152017
Analysis of bending effects for optical-bus-couplers
L Lorenz, K Nieweglowski, KJ Wolter, K Bock
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2523-2528, 2016
152016
Multichannel optical link based on polymer multimode waveguides for board-level interchip communication
K Nieweglowski, L Lorenz, KJ Wolter, K Bock
2015 European Microelectronics Packaging Conference (EMPC), 1-7, 2015
132015
Performance of step index multimode waveguides with tuned numerical aperture for on-board optical links
K Nieweglowski, R Henker, F Ellinger, KJ Wolter
Optical Interconnects XIV 8991, 27-36, 2014
132014
Optical analysis of short-distance optical interconnect on the PCB-level
K Nieweglowski, K Wolter
2006 1st Electronic Systemintegration Technology Conference 1, 392-397, 2006
122006
Will low-cost 3D additive manufactured packaging replace the fan-out wafer level packages?
T Tiedje, S Lüngen, M Schubert, M Luniak, K Nieweglowski, K Bock
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1065-1070, 2017
92017
3D optical coupling techniques on polymer waveguides for wafer and board level integration
S Lüngen, S Charania, T Tiedje, K Nieweglowski, S Killge, L Lorenz, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1612-1618, 2017
82017
Optical beam propagation and ray tracing simulation of interruption-free asymmetric multimode bus couplers
L Lorenz, K Nieweglowski, KJ Wolter, F Loosen, N Lindlein, K Bock
Journal of Microelectronics and Electronic Packaging 14 (1), 1-10, 2017
82017
Assembly tolerant design of multi-cell laser power converters for wafer-level photonic packaging
S Sohr, R Rieske, K Nieweglowski, KJ Wolter
2013 IEEE 63rd Electronic Components and Technology Conference, 1866-1873, 2013
72013
Assembly requirements for multi-channel coupling micro-optics in board-level optical interconnects
K Nieweglowski, R Rieske, KJ Wolter
3rd Electronics System Integration Technology Conference ESTC, 1-6, 2010
72010
Aerosol Jet Printed Optical Waveguides for Short Range Communication
L Lorenz, K Nieweglowski, Z Al-Husseini, N Neumann, D Plettemeier, ...
Journal of Lightwave Technology 38 (13), 3478-3484, 2020
62020
Reliability of 3D additive manufactured packages
S Lüngen, T Tiedje, K Meier, K Nieweglowski, K Bock
2018 7th Electronic System-Integration Technology Conference (ESTC), 1-5, 2018
62018
Novel optical transmitter and receiver for parallel optical interconnects on PCB-level
K Nieweglowski, KJ Wolter
2008 2nd Electronics System-Integration Technology Conference, 607-612, 2008
62008
Flexible and stretchable redistribution layer with embedded chips for human-machine interface
M Schubert, L Wambera, O Mudrievska, K Nieweglowski, J Wagner, ...
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-5, 2020
52020
Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devices
T Ackstaller, L Lorenz, K Nieweglowski, K Bock
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2019
52019
Interconnect Technology Development for 180GHz Wireless mm-Wave System-in-Foil Transceivers
K Nieweglowski, P Seiler, D Fritsche, S Lüngen, D Plettemeier, C Carta, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 527-532, 2018
52018
The system can't perform the operation now. Try again later.
Articles 1–20