| Characterization and control of residual stress and curvature in anodically bonded devices and substrates with etched features RA Inzinga, TW Lin, M Yadav, HT Johnson, GP Horn Experimental mechanics 52, 637-648, 2012 | 19 | 2012 |
| Polarization-resolved imaging for both photoelastic and photoluminescence characterization of photovoltaic silicon wafers TW Lin, LP Rowe, AJ Kaczkowski, GP Horn, HT Johnson Experimental Mechanics 56, 1339-1350, 2016 | 7 | 2016 |
| Residual stresses at cavity corners in silicon-on-insulator bonded wafers TW Lin, O Elkhatib, J Makinen, M Palokangas, HT Johnson, GP Horn Journal of Micromechanics and Microengineering 23 (9), 095004, 2013 | 7 | 2013 |
| Quantitative infrared photoelasticity of silicon photovoltaic wafers using a discrete dislocation model TW Lin, GP Horn, HT Johnson Journal of Applied Mechanics 82 (1), 011001, 2015 | 6 | 2015 |
| Polarized light emission from grain boundaries in photovoltaic silicon TW Lin, LP Rowe, AJ Kaczkowski, GP Horn, HT Johnson Extreme Mechanics Letters 9, 397-404, 2016 | 4 | 2016 |
| Anisothermal anodic bonding: A method to control global curvature and residual stress M Yadav, TW Lin, HT Johnson, GP Horn ECS Transactions 33 (4), 563, 2010 | 3 | 2010 |
| A MEMS position encoder for comb-drive actuators using suspended gate field-effect transistors TW Lin, MTK Hou, RS Chen Key Engineering Materials 326, 1379-1382, 2006 | 3 | 2006 |
| Characterization of silicon photovoltaic wafers using polarized infrared imaging TW Lin University of Illinois at Urbana-Champaign, 2015 | 2 | 2015 |
| Process induced stresses in cavity SOI wafers O Elkhatib, J Makinen, M Palokangas, TW Lin, HT Johnson, GP Horn ECS Transactions 33 (4), 543, 2010 | 2 | 2010 |
| Development of nonuniform residual stresses during anodic bonding GP Horn, R Gerbach, TW Lin, M Bernach, S Brand, HT Johnson ECS Transactions 33 (4), 553, 2010 | 2 | 2010 |
| Characterization of silicon photovoltaic wafers using infrared photoelasticity TW Lin, GP Horn, HT Johnson Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and …, 2014 | 1 | 2014 |
| Control and quantification of residual stresses in anodically bonded MEMS structures R Inzinga, T Lin, M Yadav, HT Johnson, GP Horn MEMS and Nanotechnology, Volume 2: Proceedings of the 2010 Annual Conference …, 2011 | 1 | 2011 |
| Nondestructive Photoelastic and Machine Learning Characterization of Surface Cracks and Prediction of Weibull Parameters for Photovoltaic Silicon Wafers LP Rowe, AJ Kaczkowski, TW Lin, GP Horn, HT Johnson Journal of Engineering Materials and Technology 144 (3), 031001, 2022 | | 2022 |
| residual stress state of cavity-SOI wafers, which can be verified in the R&D phase with tools such as an infrared polariscope. O Elkhatib, J Makinen, M Palokangas, TW Lin, HT Johnson, GP Horn | | |
| Abstract# 1752, 218th ECS Meeting,© 2010 The Electrochemical Society O Elkhatib, J Makinen, M Palokangas, TW Lin, HT Johnson, GP Horn | | |
