Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material JG Bai, ZZ Zhang, JN Calata, GQ Lu
IEEE Transactions on components and packaging technologies 29 (3), 589-593, 2006
384 2006 Low-temperature sintering with nano-silver paste in die-attached interconnection T Wang, X Chen, GQ Lu, GY Lei
journal of electronic materials 36 (10), 1333-1340, 2007
342 2007 Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area TG Lei, JN Calata, GQ Lu, X Chen, S Luo
IEEE Transactions on Components and Packaging Technologies 33 (1), 98-104, 2009
244 2009 Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow Z Zhang, GQ Lu
IEEE Transactions on electronics packaging manufacturing 25 (4), 279-283, 2002
240 2002 Thermomechanical reliability of low-temperature sintered silver die attached SiC power device assembly JG Bai, GQ Lu
IEEE Transactions on device and materials reliability 6 (3), 436-441, 2006
223 2006 Pressure‐enhanced crystallization kinetics of amorphous Si and Ge: Implications for point‐defect mechanisms GQ Lu, E Nygren, MJ Aziz
Journal of applied physics 70 (10), 5323-5345, 1991
204 1991 The activation strain tensor: Nonhydrostatic stress effects on crystal-growth kinetics MJ Aziz, PC Sabin, GQ Lu
Physical Review B 44 (18), 9812, 1991
204 1991 High-temperature operation of SiC power devices by low-temperature sintered silver die-attachment JG Bai, J Yin, Z Zhang, GQ Lu, JD van Wyk
IEEE transactions on advanced packaging 30 (3), 506-510, 2007
167 2007 Processing and characterization of nanosilver pastes for die-attaching SiC devices JG Bai, JN Calata, GQ Lu
IEEE Transactions on electronics packaging manufacturing 30 (4), 241-245, 2007
157 2007 Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment D Yu, X Chen, G Chen, G Lu, Z Wang
Materials & Design 30 (10), 4574-4579, 2009
149 2009 Technology trends toward a system-in-a-module in power electronics FC Lee, JD van Wyk, D Boroyevich, GQ Lu, Z Liang, P Barbosa
IEEE Circuits and systems magazine 2 (4), 4-22, 2002
128 2002 Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance X Cao, T Wang, KDT Ngo, GQ Lu
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (4 …, 2011
117 2011 Three-dimensional packaging for power semiconductor devices and modules JN Calata, JG Bai, X Liu, S Wen, GQ Lu
IEEE transactions on advanced packaging 28 (3), 404-412, 2005
112 2005 Circumferential-mode, quasi-ring-type, magnetoelectric laminate composite—a highly sensitive electric current and∕ or vortex magnetic field sensor S Dong, JG Bai, J Zhai, JF Li, GQ Lu, D Viehland, S Zhang, TR Shrout
Applied Physics Letters 86 (18), 182506, 2005
111 2005 A novel high-temperature planar package for SiC multichip phase-leg power module P Ning, TG Lei, F Wang, GQ Lu, KDT Ngo, K Rajashekara
IEEE Transactions on power Electronics 25 (8), 2059-2067, 2010
109 2010 Effect of mismatched sintering kinetics on camber in a low‐temperature cofired ceramic package GQ Lu, RC Sutterlin, TK Gupta
Journal of the American Ceramic Society 76 (8), 1907-1914, 1993
104 1993 A lead-free, low-temperature sintering die-attach technique for high-performance and high-temperature packaging GQ Lu, JN Calata, Z Zhang, JG Bai
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem …, 2004
102 2004 An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures S Haque, K Xing, RL Lin, CTA Suchicital, GQ Lu, DJ Nelson, D Borojevic, ...
IEEE Transactions on Advanced Packaging 22 (2), 136-144, 1999
101 1999 In vitro photothermal study of gold nanoshells functionalized with small targeting peptides to liver cancer cells SY Liu, ZS Liang, F Gao, SF Luo, GQ Lu
Journal of Materials Science: Materials in Medicine 21 (2), 665-674, 2010
95 2010 Pressureless sintering of nanosilver paste at low temperature to join large area (≥ 100 mm2) power chips for electronic packaging S Fu, Y Mei, GQ Lu, X Li, G Chen, X Chen
Materials Letters 128, 42-45, 2014
93 2014 
Khai NgoProfessor of Electrical and Computer Engineering, Virginia TechZweryfikowany adres z vt.edu
