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Morgana Ribas
Morgana Ribas
Sr. R&D Manager, Metals Technology, MacDermid Alpha Electronics Solutions
Zweryfikowany adres z alphaassembly.com
Tytuł
Cytowane przez
Cytowane przez
Rok
H-Spillover through the Catalyst Saturation: An Ab Initio Thermodynamics Study
AK Singh, MA Ribas, BI Yakobson
Acs Nano 3 (7), 1657-1662, 2009
1492009
Patterning nanoroads and quantum dots on fluorinated graphene
MA Ribas, AK Singh, PB Sorokin, BI Yakobson
Nano Research 4 (1), 143-152, 2011
1462011
The ultimate diamond slab: GraphAne versus graphEne
E Muñoz, AK Singh, MA Ribas, ES Penev, BI Yakobson
Diamond and Related Materials 19 (5), 368-373, 2010
1062010
Nanotube nucleation versus carbon-catalyst adhesion–Probed by molecular dynamics simulations
MA Ribas, F Ding, PB Balbuena, BI Yakobson
The Journal of chemical physics 131 (22), 224501, 2009
802009
Carbon nanotube nucleation driven by catalyst morphology dynamics
E Pigos, ES Penev, MA Ribas, R Sharma, BI Yakobson, AR Harutyunyan
ACS nano 5 (12), 10096-10101, 2011
662011
Development of low-temperature drop shock resistant solder alloys for handheld devices
M Ribas, S Chegudi, A Kumar, R Pandher, R Raut, S Mukherjee, S Sarkar, ...
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th, 48-52, 2013
212013
Lead-free and antimony-free tin solder reliable at high temperatures
P Choudhury, M de Avila Ribas, S Mukherjee, A Kumar, S Sarkar, ...
US Patent App. 14/698,450, 2015
17*2015
Sintering powder
S Ghosal, R Pandher, O Khaselev, R Bhatkal, R Raut, B Singh, M Ribas, ...
US Patent 20150353804A1, 2013
12*2013
Low Temperature High Reliability Alloy for Solder Hierarchy
P Choudhury, M de Avila Ribas, S Mukherjee, S Sarkar, R Pandher, ...
US Patent 20170197281A1, 2015
8*2015
Mathematical model of over-micron and nano-scale powders accumulation in a coke fixed-bed filter
M de AVILA RIBAS, H NOGAMI, R TAKAHASHI, J YAGI
ISIJ international 45 (3), 303-311, 2005
82005
Solder compositions
M de Avila Ribas, D Lodge, R Pandher, B Singh, RM Bhatkal, R Raut, ...
US Patent App. 14/236,480, 2012
62012
Low Temperature Alloy Development for Electronics Assembly–Part II
M Ribas, S Chegudi, A Kumar, S Mukherjee, S Sarkar, R Pandher, R Raut, ...
Proc. SMTA International, Fort Worth, TX, 2013
52013
Development of Lead-Free Alloys with Ultra-High Thermo-Mechanical Reliability
P Choudhury, M Ribas, R Pandher, A Kumar, S Mukherjee, S Sarkar, ...
Proc. of SMTA International, Chicago, 2015
42015
High impact toughness solder alloy
R Pandher, B Singh, S Sarkar, S Chegudi, AKN Kumar, K Chattopadhyay, ...
US Patent App. 14/236,432, 2012
42012
Thermal and mechanical reliability of low-temperature solder alloys for handheld devices
M Ribas, S Chegudi, A Kumar, R Pandher, R Raut, S Mukherjee, S Sarkar, ...
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 366-371, 2014
32014
High Impact Solder Toughness Alloy
R Pandher, B Singh, S Sarkar, S Chegudi, AKN Kumar, K Chattopadhyay, ...
US Patent 20170304955A1, 2017
22017
Rosin-free thermosetting flux formulations
MDA Ribas, R Raut, TC Cucu, ST Yong, S Sarkar, RH Katagiriyappa
US Patent 20160318134A1, 2014
22014
High impact solder toughness alloy
R Pandher, B Singh, S Sarkar, S Chegudi, AKN Kumar, K Chattopadhyay, ...
US Patent App. 14/980,105, 2015
12015
Wafer level CSP with ultra-high thermal reliability lead-free alloys
M Ribas, G Lim, RT Bumagat, A Kumar, D Kosuri, P Augustine, ...
Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th, 1-6, 2015
12015
Lead-free and antimony-free tin solder reliable at high temperatures
P Choudhury, M de Avila Ribas, S Mukherjee, A Kumar, S Sarkar, ...
US Patent 20160023309A1, 2015
12015
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