| Internet der Dinge: www. internet-der-dinge. de HJ Bullinger, M ten Hompel Springer, 2007 | 251 | 2007 |
| Carrier techniques for thin wafer processing C Landesberger, S Scherbaum, K Bock CS Mantech Conference 49, 33-36, 2007 | 226 | 2007 |
| Handbook of wafer bonding P Ramm, JJQ Lu, MMV Taklo John Wiley & Sons, 2011 | 162 | 2011 |
| Ultra-thin chip technology and applications J Burghartz Springer Science & Business Media, 2010 | 162 | 2010 |
| Investigations of the influence of dicing techniques on the strength properties of thin silicon S Schoenfelder, M Ebert, C Landesberger, K Bock, J Bagdahn Microelectronics reliability 47 (2-3), 168-178, 2007 | 109 | 2007 |
| Non-uniform triggering of gg-nMOSt investigated by combined emission microscopy and transmission line pulsing C Russ, K Bock, M Rasras, I De Wolf, G Groeseneken, HE Maes Electrical Overstress/Electrostatic Discharge Symposium Proceedings. 1998 …, 1998 | 102 | 1998 |
| Polymer electronics systems-polytronics K Bock Proceedings of the IEEE 93 (8), 1400-1406, 2005 | 99 | 2005 |
| Roll-to-roll processing of film substrates for hybrid integrated flexible electronics N Palavesam, S Marin, D Hemmetzberger, C Landesberger, K Bock, ... Flexible and Printed Electronics 3 (1), 014002, 2018 | 98 | 2018 |
| Development of pH-sensitive indicator dyes for the preparation of micro-patterned optical sensor layers S Trupp, M Alberti, T Carofiglio, E Lubian, H Lehmann, R Heuermann, ... Sensors and Actuators B: Chemical 150 (1), 206-210, 2010 | 75 | 2010 |
| The challenge of ultra thin chip assembly M Feil, C Adler, D Hemmetzberger, M Konig, K Bock 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 74 | 2004 |
| Roll-to-roll hot embossing of microstructures T Velten, F Bauerfeld, H Schuck, S Scherbaum, C Landesberger, K Bock Microsystem technologies 17, 619-627, 2011 | 72 | 2011 |
| Influence of gate length on ESD-performance for deep sub micron CMOS technology K Bock, B Keppens, V De Heyn, G Groeseneken, LY Ching, A Naem Electrical Overstress/Electrostatic Discharge Symposium Proceedings. 1999 …, 1999 | 65 | 1999 |
| Fokus Innovation : Kräfte bündeln - Prozesse beschleunigen Bullinger Hanser, 2006 | 62* | 2006 |
| Automated 10-channel capillary chip immunodetector for biological agents detection E Yacoub-George, W Hell, L Meixner, F Wenninger, K Bock, P Lindner, ... Biosensors and Bioelectronics 22 (7), 1368-1375, 2007 | 61 | 2007 |
| Photonic curing of sol–gel derived HfO2 dielectrics for organic field-effect transistors K Tetzner, KA Schroder, K Bock Ceramics International 40 (10), 15753-15761, 2014 | 55 | 2014 |
| Tactile internet: With human-in-the-Loop FHP Fitzek, SC Li, S Speidel, T Strufe, M Simsek, M Reisslein Academic Press, 2021 | 52 | 2021 |
| ESD issues in compound semiconductor high frequency devices and circuits K Bock Proceedings Electrical Overstress/Electrostatic Discharge Symposium, 1-12, 1997 | 51 | 1997 |
| Microfluidics on foil: state of the art and new developments T Velten, H Schuck, M Richter, G Klink, K Bock, CK Malek, S Roth, ... Proceedings of the Institution of Mechanical Engineers, Part B: Journal of …, 2008 | 46 | 2008 |
| Foldable Flex and Thinned Silicon multichip packaging technology JW Balde Springer Science & Business Media, 2003 | 46 | 2003 |
| Architecture and advanced electronics pathways toward highly adaptive energy-efficient computing GP Fettweis, M Dörpinghaus, J Castrillon, A Kumar, C Baier, K Bock, ... Proceedings of the IEEE 107 (1), 204-231, 2018 | 44 | 2018 |
Krzysztof NieweglowskiTechnische Universität Dresden, Institute of Electronic Packaging TechnologyVerified email at tu-dresden.de
