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Krzysztof NieweglowskiTechnische Universität Dresden, Institute of Electronic Packaging TechnologyVerified email at tu-dresden.de- Karsten MeierTechnische Universität DresdenVerified email at tu-dresden.de
- Lukas LorenzFraunhofer Institut für Photonische MikrosystemeVerified email at arcor.de
- Guido Groesenekenimec and KU LeuvenVerified email at imec.be
- Dr.-Ing. Nagarajan PalavesamResearch Associate, Fraunhofer EMFTVerified email at emft.fraunhofer.de
- Klaus-Juergen WolterProfessor für Verfahrenstechnologie der Elektronik, TU DresdenVerified email at tu-dresden.de
- Jörg FrankeFriedrich-Alexander University of Erlangen-NürnbergVerified email at faps.uni-erlangen.de
- Frank EllingerTechnische Universität DresdenVerified email at tu-dresden.de
- Dirk PlettemeierProfessor of Radio Frequency and Photonics Engineering, Technische Universität DresdenVerified email at tu-dresden.de
- Peter RammHead of Strategic Projects at Fraunhofer EMFTVerified email at emft.fraunhofer.de
- Ludger OvermeyerProfessor, Leibniz Universität Hannover, GermanyVerified email at ita.uni-hannover.de
- Gerd-Albert HoffmannLaser Zentrum Hannover e.V.Verified email at lzh.de
- Kornelius TetznerFerdinand-Braun-InstitutVerified email at fbh-berlin.de
- Martin SchubertInstitut für Aufbau- und Verbindungstechnik der Elektronik, Technische Universität DresdenVerified email at tu-dresden.de
- Thomas ReitbergerMicro Epsilon, Product Manager 3D-Sensors, Dr.-Ing.Verified email at micro-epsilon.de
- Abhijit DasguptaProfessor of Mechanical Engineering, University of MarylandVerified email at umd.edu
- Paul SvastaProfesor, Universitatea Politehnica din BucurestiVerified email at cetti.ro
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Karlheinz Bock
TU Dresden, Chair of Electronics Packaging (W3)
Verified email at tu-dresden.de - Homepage