Karlheinz Bock
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Internet der Dinge: www. internet-der-dinge. de
HJ Bullinger, M ten Hompel
Springer, 2007
Carrier techniques for thin wafer processing
C Landesberger, S Scherbaum, K Bock
CS Mantech Conference 49, 33-36, 2007
Handbook of wafer bonding
P Ramm, JJQ Lu, MMV Taklo
John Wiley & Sons, 2011
Ultra-thin chip technology and applications
J Burghartz
Springer Science & Business Media, 2010
Investigations of the influence of dicing techniques on the strength properties of thin silicon
S Schoenfelder, M Ebert, C Landesberger, K Bock, J Bagdahn
Microelectronics reliability 47 (2-3), 168-178, 2007
Non-uniform triggering of gg-nMOSt investigated by combined emission microscopy and transmission line pulsing
C Russ, K Bock, M Rasras, I De Wolf, G Groeseneken, HE Maes
Electrical Overstress/Electrostatic Discharge Symposium Proceedings. 1998 …, 1998
Polymer electronics systems-polytronics
K Bock
Proceedings of the IEEE 93 (8), 1400-1406, 2005
Roll-to-roll processing of film substrates for hybrid integrated flexible electronics
N Palavesam, S Marin, D Hemmetzberger, C Landesberger, K Bock, ...
Flexible and Printed Electronics 3 (1), 014002, 2018
Development of pH-sensitive indicator dyes for the preparation of micro-patterned optical sensor layers
S Trupp, M Alberti, T Carofiglio, E Lubian, H Lehmann, R Heuermann, ...
Sensors and Actuators B: Chemical 150 (1), 206-210, 2010
The challenge of ultra thin chip assembly
M Feil, C Adler, D Hemmetzberger, M Konig, K Bock
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
Roll-to-roll hot embossing of microstructures
T Velten, F Bauerfeld, H Schuck, S Scherbaum, C Landesberger, K Bock
Microsystem technologies 17, 619-627, 2011
Influence of gate length on ESD-performance for deep sub micron CMOS technology
K Bock, B Keppens, V De Heyn, G Groeseneken, LY Ching, A Naem
Electrical Overstress/Electrostatic Discharge Symposium Proceedings. 1999 …, 1999
Fokus Innovation : Kräfte bündeln - Prozesse beschleunigen
Hanser, 2006
Automated 10-channel capillary chip immunodetector for biological agents detection
E Yacoub-George, W Hell, L Meixner, F Wenninger, K Bock, P Lindner, ...
Biosensors and Bioelectronics 22 (7), 1368-1375, 2007
Photonic curing of sol–gel derived HfO2 dielectrics for organic field-effect transistors
K Tetzner, KA Schroder, K Bock
Ceramics International 40 (10), 15753-15761, 2014
Tactile internet: With human-in-the-Loop
FHP Fitzek, SC Li, S Speidel, T Strufe, M Simsek, M Reisslein
Academic Press, 2021
ESD issues in compound semiconductor high frequency devices and circuits
K Bock
Proceedings Electrical Overstress/Electrostatic Discharge Symposium, 1-12, 1997
Microfluidics on foil: state of the art and new developments
T Velten, H Schuck, M Richter, G Klink, K Bock, CK Malek, S Roth, ...
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of …, 2008
Foldable Flex and Thinned Silicon multichip packaging technology
JW Balde
Springer Science & Business Media, 2003
Architecture and advanced electronics pathways toward highly adaptive energy-efficient computing
GP Fettweis, M Dörpinghaus, J Castrillon, A Kumar, C Baier, K Bock, ...
Proceedings of the IEEE 107 (1), 204-231, 2018
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