| Reliability analysis of tape based chip-scale packages based metamodel H Hamdani, A El Hami, B Radi Microelectronics Reliability 102, 113445, 2019 | 11 | 2019 |
| Optimization of solder joints in embedded mechatronic systems via Kriging-assisted CMA-ES algorithm H Hamdani, B Radi, A El Hami International Journal for Simulation and Multidisciplinary Design …, 2019 | 11 | 2019 |
| Métamodélisation pour une conception robuste des systèmes mécatroniques H Hamdani, B Radi, A El Hami Incertitudes et fiabilité des systèmes multiphysiques 2 (10), 2017 | 8 | 2017 |
| Metamodel assisted evolution strategies for global optimization of solder joints reliability in embedded mechatronic devices H Hamdani, B Radi, A El Hami Microsystem Technologies 25, 3801-3812, 2019 | 7 | 2019 |
| Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS© and R H Hamdani, B Radi, A El Hami International Journal for Simulation and Multidisciplinary Design …, 2022 | 4 | 2022 |
| Métamodèles pour l’étude fiabiliste des systèmes mécatroniques H Hamdani Normandie, 2019 | 3 | 2019 |
| Submodeling technique for assessment and numerical prediction of solder joints failures in mechatronic devices H Hamdani, B Radi, A Elhami 13th Mechanical Congress, Meknes, Morocco, Apr, 11-14, 2017 | 2 | 2017 |
| Reliability Analysis based on Metamodels of Chip-Scale Packages (CSP) H Hamdani, A El Hami, B Radi Embedded Mechatronic Systems 2, 247-271, 2020 | 1 | 2020 |
| Probabilistic methodology for reliability assessment of electronic packages H Hamdani, B Radi, A El Hami MATEC Web of Conferences 286, 02002, 2019 | 1 | 2019 |
Abdelkhalak EL HAMIFull Professor, INSA Rouen, Normandy UniversityVerified email at insa-rouen.fr
Abdelkhalak EL HAMIFull Professor, INSA Rouen, Normandy UniversityVerified email at insa-rouen.fr