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Ziyang ChengUniversity of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
Shing Chow ChanDept. of EEE, The University of Hong KongVerified email at eee.hku.hk
Chongtao Guo (郭重涛)Shenzhen University, Shenzhen, ChinaVerified email at szu.edu.cn
Lei HuangShenzhen UniversityVerified email at szu.edu.cn
Peng Xiao中山大学 Sun Yat-sen UniversityVerified email at mail.sysu.edu.cn
Huiping HUANGMarie Curie Fellow, Chalmers University of Technology, Darmstadt University of TechnologyVerified email at chalmers.se
Zhiguo Zhang 张治国Harbin Institute of Technology (Shenzhen)Verified email at hit.edu.cn
Hing Cheung SoCity University of Hong KongVerified email at ee.cityu.edu.hk
Xiansheng GuoUniversity of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
Yue YangSichuan UniversityVerified email at scu.edu.cn
Zhi QuanShenzhen UniversityVerified email at szu.edu.cn
Tong WeiUniversité du LuxembourgVerified email at uni.lu
Nirwan AnsariDistinguished Professor of Electrical and Computer Engineering, New Jersey Institute of TechnologyVerified email at njit.edu
Xiang-Gen XiaDepartment of Electrical and Computer Engineering, University of Delaware, Newark, DE 19716, USAVerified email at ee.udel.edu
Jian LiElectrical, University of Florida, University of Kentucky, Ohio State UniversityVerified email at dsp.ufl.edu
shengli zhangshenzhen university, university of science and technology of china, chinese university of hong kongVerified email at szu.edu.cn