A circuit reduction technique for finding the steady-state solution of nonlinear circuits E Gad, R Khazaka, RS Nakhla, R Griffith IEEE Transactions on Microwave theory and techniques 48 (12), 2389-2396, 2000 | 81 | 2000 |
Generalized hermite polynomial chaos for variability analysis of macromodels embeddedin nonlinear circuits MR Rufuie, E Gad, M Nakhla, R Achar IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (4 …, 2013 | 75 | 2013 |
Decoupled polynomial chaos and its applications to statistical analysis of high-speed interconnects TA Pham, E Gad, MS Nakhla, R Achar IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014 | 72 | 2014 |
Passive model reduction of multiport distributed interconnects A Dounavis, E Gad, R Achar, MS Nakhla IEEE Transactions on Microwave Theory and Techniques 48 (12), 2325-2334, 2000 | 68 | 2000 |
-Stable and -Stable High-Order Integration Methods for Solving Stiff Differential Equations E Gad, M Nakhla, R Achar, Y Zhou IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2009 | 55 | 2009 |
Efficient simulation of nonuniform transmission lines using integrated congruence transform E Gad, M Nakhla IEEE Transactions on Very Large Scale Integration (VLSI) Systems 12 (12 …, 2004 | 44 | 2004 |
Passive order reduction for RLC circuits with delay elements W Tseng, C Chen, E Gad, M Nakhla, R Achar IEEE Transactions on Advanced Packaging 30 (4), 830-840, 2007 | 43 | 2007 |
Passivity verification in delay-based macromodels of electrical interconnects E Gad, C Chen, M Nakhla, R Achar IEEE Transactions on Circuits and Systems I: Regular Papers 52 (10), 2173-2187, 2005 | 39 | 2005 |
Structural Characterization and Efficient Implementation Techniques for-Stable High-Order Integration Methods Y Zhou, E Gad, MS Nakhla, R Achar IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2011 | 36 | 2011 |
Passivity verification in delay-based macromodels of multiconductor electrical interconnects C Chen, E Gad, M Nakhla, R Achar IEEE transactions on advanced packaging 30 (2), 246-256, 2007 | 33 | 2007 |
A new algorithm for learning in piecewise-linear neural networks EF Gad, AF Atiya, S Shaheen, A El-Dessouki Neural Networks 13 (4-5), 485-505, 2000 | 33 | 2000 |
Efficient model reduction of linear periodically time-varying systems via compressed transient system function E Gad, M Nakhla IEEE Transactions on Circuits and Systems I: Regular Papers 52 (6), 1188-1204, 2005 | 25 | 2005 |
Simulation and automated modeling of microwave circuits: State-of-the-art and emerging trends QJ Zhang, E Gad, B Nouri, W Na, M Nakhla IEEE Journal of Microwaves 1 (1), 494-507, 2021 | 24 | 2021 |
Fast variability analysis of general nonlinear circuits using decoupled polynomial chaos MR Rufuie, E Gad, MS Nakhla, R Achar IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 21 | 2015 |
Simulation and sensitivity analysis of nonuniform transmission lines using integrated congruence transform E Gad, M Nakhla IEEE transactions on advanced packaging 28 (1), 32-44, 2005 | 21 | 2005 |
Passivity compensation algorithm for method-of-characteristics-based multiconductor transmission line interconnect macromodels C Chen, D Saraswat, R Achar, E Gad, MS Nakhla, MCE Yagoub IEEE transactions on very large scale integration (VLSI) systems 17 (8 …, 2009 | 18 | 2009 |
Fast simulation of microwave circuits with nonlinear terminations using high-order stable methods MA Farhan, E Gad, MS Nakhla, R Achar IEEE transactions on microwave theory and techniques 61 (1), 360-371, 2012 | 15 | 2012 |
New method for fast transient simulation of large linear circuits using high-order stable methods MA Farhan, E Gad, MS Nakhla, R Achar IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (4 …, 2013 | 14 | 2013 |
Circuit-based analysis of electromagnetic field coupling with nonuniform transmission lines E Gad IEEE Transactions on Electromagnetic Compatibility 50 (1), 149-165, 2008 | 14 | 2008 |
Fast and stable time-domain simulation based on modified numerical inversion of the Laplace transform Y Tao, E Gad, M Nakhla IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 13 | 2021 |