Pradeep Lall
Title
Cited by
Cited by
Year
How to do xtabond2: An introduction to difference and system GMM in Stata
D Roodman
The stata journal 9 (1), 86-136, 2009
8456*2009
CRC handbook of thermal engineering
F Kreith, RP Chhabra
CRC press, 2017
5192017
Introductions
H Hall
Hall and B. Gieben (eds) Formation of Modernity. Cambridge: Polity, 1992
411*1992
Influence of temperature on microelectronics and system reliability: A physics of failure approach
P Lall, M Pecht, EB Hakim
CRC press, 1997
2691997
Reliability of the aging lead free solder joint
H Ma, JC Suhling, P Lall, MJ Bozack
56th Electronic Components and Technology Conference 2006, 16 pp., 2006
251*2006
The electrical engineering handbook
WK Chen
Elsevier, 2004
2302004
The influence of elevated temperature aging on reliability of lead free solder joints
H Ma, JC Suhling, Y Zhang, P Lall, MJ Bozack
2007 Proceedings 57th Electronic Components and Technology Conference, 653-668, 2007
1972007
Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact
P Lall, DR Panchagade, Y Liu, RW Johnson, JC Suhling
IEEE Transactions on Components and Packaging Technologies 29 (3), 464-474, 2006
1722006
Model for BGA and CSP reliability in automotive underhood applications
P Lall, MN Islam, N Singh, JC Suhling, R Darveaux
IEEE Transactions on Components and Packaging Technologies 27 (3), 585-593, 2004
1552004
Solder joint reliability in electronics under shock and vibration using explicit finite-element submodeling
P Lall, S Gupte, P Choudhary, J Suhling
IEEE transactions on electronics packaging manufacturing 30 (1), 74-83, 2007
1522007
The effects of aging temperature on SAC solder joint material behavior and reliability
Y Zhang, Z Cai, JC Suhling, P Lall, MJ Bozack
2008 58th Electronic Components and Technology Conference, 99-112, 2008
1452008
Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies
P Lall, P Choudhary, S Gupte, J Suhling
56th Electronic Components and Technology Conference 2006, 10 pp., 2006
1432006
Flexible connector for circuit boards
JG Gillette, SG Potter, P Lall
US Patent 5,742,484, 1998
1301998
Prognostics and health management of electronic packaging
P Lall, MN Islam, MK Rahim, JC Suhling
IEEE Transactions on Components and Packaging Technologies 29 (3), 666-677, 2006
1292006
Failure-envelope approach to modeling shock and vibration survivability of electronic and MEMS packaging
P Lall, DR Panchagade, P Choudhary, S Gupte, JC Suhling
IEEE Transactions on Components and Packaging Technologies 31 (1), 104-113, 2008
1242008
Reduction of lead free solder aging effects using doped SAC alloys
Z Cai, Y Zhang, JC Suhling, P Lall, RW Johnson, MJ Bozack
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
1182010
Statistical pattern recognition and built-in reliability test for feature extraction and health monitoring of electronics under shock loads
P Lall, P Choudhary, S Gupte, J Hofmeister
IEEE Transactions on Components and Packaging Technologies 32 (3), 600-616, 2009
1152009
Determination of Anand constants for SAC solders using stress-strain or creep data
M Motalab, Z Cai, JC Suhling, P Lall
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
1092012
Feature extraction and damage-precursors for prognostication of lead-free electronics
P Lall, M Hande, C Bhat, N Islam, J Suhling, J Lee
56th Electronic Components and Technology Conference 2006, 10 pp., 2006
101*2006
Improved predictions of lead free solder joint reliability that include aging effects
M Motalab, Z Cai, JC Suhling, J Zhang, JL Evans, MJ Bozack, P Lall
2012 IEEE 62nd Electronic Components and Technology Conference, 513-531, 2012
1002012
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