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Chia-Ling Pai
Chia-Ling Pai
Ph.D., Chemical Engineering, MIT
Verified email at amat.com
Title
Cited by
Cited by
Year
Morphology of porous and wrinkled fibers of polystyrene electrospun from dimethylformamide
CL Pai, MC Boyce, GC Rutledge
Macromolecules 42 (6), 2102-2114, 2009
3092009
Spin coating of conjugated polymers for electronic and optoelectronic applications
CC Chang, CL Pai, WC Chen, SA Jenekhe
Thin solid films 479 (1-2), 254-260, 2005
1812005
Mechanical properties of individual electrospun PA 6 (3) T fibers and their variation with fiber diameter
CL Pai, MC Boyce, GC Rutledge
Polymer 52 (10), 2295-2301, 2011
1622011
Wrinkled surface topographies of electrospun polymer fibers
L Wang, CL Pai, MC Boyce, GC Rutledge
Applied Physics Letters 94 (15), 2009
1342009
Elastic–plastic behavior of non-woven fibrous mats
MN Silberstein, CL Pai, GC Rutledge, MC Boyce
Journal of the Mechanics and Physics of Solids 60 (2), 295-318, 2012
1282012
On the importance of fiber curvature to the elastic moduli of electrospun nonwoven fiber meshes
CL Pai, MC Boyce, GC Rutledge
Polymer 52 (26), 6126-6133, 2011
1212011
Electronic structure and properties of alternating donor–acceptor conjugated copolymers: 3, 4-Ethylenedioxythiophene (EDOT) copolymers and model compounds
CL Pai, CL Liu, WC Chen, SA Jenekhe
Polymer 47 (2), 699-708, 2006
1172006
Electronic Properties and Field‐Effect Transistors of Thiophene‐Based Donor–Acceptor Conjugated Copolymers
RD Champion, KF Cheng, CL Pai, WC Chen, SA Jenekhe
Macromolecular rapid communications 26 (23), 1835-1840, 2005
922005
Characterization by mercury porosimetry of nonwoven fiber media with deformation
GC Rutledge, JL Lowery, CL Pai
Journal of engineered fibers and fabrics 4 (3), 155892500900400301, 2009
522009
Photophysical and electroluminescent properties of fluorene‐based binary and ternary donor–acceptor polymer blends
WC Wu, WY Lee, CL Pai, WC Chen, CS Tuan, JL Lin
Journal of Polymer Science Part B: Polymer Physics 45 (1), 67-78, 2007
202007
Morphology and mechanical properties of electrospun polymeric fibers and their nonwoven fabrics
CL Pai
Massachusetts Institute of Technology, 2011
112011
Semiconductor device and method of forming the same
WVWN Chen, PAI Chia-Ling, PY Tsai
US Patent App. 18/162,714, 2024
2024
Mechanics of electrospun fiber membranes: From fine fibers to flowing fluids
LT Choong, MM Mannarino, CL Pai, GC Rutledge
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY 247, 2014
2014
Determination of Young's moduli for amorphous nylon single fibers and relation to their nonwovens
CL Pai, MC Boyce, GC Rutledge
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY 241, 2011
2011
Cover Picture: Macromol. Rapid Commun. 23/2005
RD Champion, KF Cheng, CL Pai, WC Chen, SA Jenekhe
Macromolecular Rapid Communications 26 (23), 1821-1821, 2005
2005
電子施體/受體共軛高分子系統之理論計算及特性應用
CL Pai
國立臺灣大學化學工程學系學位論文 2005, 1-137, 2005
2005
Theoretical studies on thiophene based alternating donor-acceptor conjugated polymers and their model compounds
CL Pai, WC Chen
ABSTR PAP AMER CHEM SOC, 2005
2005
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