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Citations per year
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Cited by
All
Since 2019
Citations
187
137
h-index
4
4
i10-index
4
4
0
40
20
2016
2017
2018
2019
2020
2021
2022
2023
2024
6
19
23
23
17
39
23
29
6
Follow
Ai Ting Tan
PhD student
Verified email at siswa.um.edu.my
Soldering
ultrasonic joining
Articles
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Year
Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions
AT Tan, AW Tan, F Yusof
Science and technology of advanced materials 16 (3), 033505
, 2015
80
2015
Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering
AT Tan, AW Tan, F Yusof
Ultrasonics sonochemistry 34, 616-625
, 2017
48
2017
Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power
AT Tan, AW Tan, F Yusof
Journal of Alloys and Compounds 705, 188-197
, 2017
43
2017
Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints
AT Tan, AW Tan, F Yusof
Journal of Materials Processing Technology 238, 8-14
, 2016
16
2016
Ultrasonic assisted reflow soldering of lead free solder joint/Tan Ai Ting
AT Tan
University of Malaya
, 2017
2017
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