| A machine learning based approach to detect false calls in SMT manufacturing N Thielen, D Werner, K Schmidt, R Seidel, A Reinhardt, J Franke 2020 43rd international spring seminar on electronics technology (ISSE), 1-6, 2020 | 25 | 2020 |
| Enhanced X-ray inspection of solder joints in SMT electronics production using convolutional neural networks K Schmidt, N Thielen, C Voigt, R Seidel, J Franke, Y Milde, J Bönig, ... 2020 IEEE 26th International Symposium for Design and Technology in …, 2020 | 16 | 2020 |
| Development and validation of a digital twin framework for SMT manufacturing R Seidel, B Rachinger, N Thielen, K Schmidt, S Meier, J Franke Computers in industry 145, 103831, 2023 | 13 | 2023 |
| Data mining system architecture for industrial internet of things in electronics production R Seidel, H Amada, J Fuchs, N Thielen, K Schmidt, C Voigt, J Franke 2020 IEEE 26th International Symposium for Design and Technology in …, 2020 | 9 | 2020 |
| Development and Test of a Data Framework for Prediction of Soldering Quality in Selective Wave Soldering Applying K-Nearest Neighbors R Seidel, N Thielen, K Schmidt, C Voigt, J Franke 2020 IEEE 26th International Symposium for Design and Technology in …, 2020 | 6 | 2020 |
| A process model for systematically setting up the data basis for data-driven projects in manufacturing S Meier, S Klarmann, N Thielen, C Pfefferer, M Kuhn, J Franke Journal of Manufacturing Systems 71, 1-19, 2023 | 3 | 2023 |
| Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing N Thielen, Z Jiang, K Schmidt, R Seidel, C Voigt, A Reinhardt, J Franke 2021 IEEE 27th International Symposium for Design and Technology in …, 2021 | 3 | 2021 |
| Prediction of the Solder Rise in Selective Wave Soldering Comparing Decision Tree and Logistic Regression R Seidel, F Leibold, N Thielen, J Franke 2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-7, 2020 | 3 | 2020 |
| Experimental Investigation on Thermocouple Attachment Methods for Reliable Temperature Measurement R Seidel, J Volland, N Thielen, C Voigt, J Franke 2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2020 | 3 | 2020 |
| Trustworthiness of machine learning models in manufacturing applications using the example of electronics manufacturing processes R Seidel, K Schmidt, N Thielen, J Franke Procedia CIRP 107, 487-492, 2022 | 2 | 2022 |
| Machine Learning Approach towards Quality Control of Aerosol-Jet Printed Polymer Optical Waveguides Material MK Hamjah, N Thielen, JE Hagelloch, J Franke 2021 IEEE Region 10 Symposium (TENSYMP), 1-5, 2021 | 2 | 2021 |
| An automated optical inspection system for PIP solder joint classification using convolutional neural networks K Schmidt, D Rauchensteiner, C Voigt, N Thielen, J Bönig, G Beitinger, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2205-2210, 2021 | 2 | 2021 |
| Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components C Voigt, M Petersen, N Thielen, D Utsch, F Häußler, M Kirchberger, ... 2023 46th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2023 | 1 | 2023 |
| Machine Learning Based Quality Prediction for Solder Paste Dispensing in Electronics Production N Thielen, W Pan, N Piechulek, C Voigt, S Meier, K Schmidt, J Franke 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 858-863, 2022 | 1 | 2022 |
| Attention-based image compression in sensor assembly S Meier, A Erkan, N Thielen, S Klarmann, J Franke 2022 IEEE 28th International Symposium for Design and Technology in …, 2022 | 1 | 2022 |
| Multi-Model Machine Learning based Industrial Vision Framework for Assembly Part Quality Control M Schwab, C Madeline-Dérou, S Klarmann, N Thielen, S Meier, J Franke, ... 2022 IEEE 27th International Conference on Emerging Technologies and Factory …, 2022 | 1 | 2022 |
| Optimizing Machine Learning Performance via Dataset Generation for X-ray Image Classification F Mahr, K Schmidt, N Thielen, T Sindel, J Franke 2024 25th International Conference on Thermal, Mechanical and Multi-Physics …, 2024 | | 2024 |
| Anomaly Detection for Dispensing of Solder Paste on 3D Circuit Carriers Using Machine Learning N Thielen, M Wagner, S Meier, C Voigt, J Franke 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 932-937, 2023 | | 2023 |
| Customized production of highly integrated 3D power electronic modules by multi-material vat photopolymerization, powder bed fusion and selective piezojet metallization … J Schubert, CL Lehmann, F Zanger, V Schulze, D Utsch, N Thielen, ... 15th Internationaler MID-Kongress-Mechatronic Integrated Discourse (2023 …, 2023 | | 2023 |
