Biocompatible packaging for implantable miniaturized pressure sensor device used for stent grafts: Concept and choice of materials S Kirsten, M Schubert, M Braunschweig, G Woldt, T Voitsekhivska, ... 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 719-724, 2014 | 20 | 2014 |
Will low-cost 3D additive manufactured packaging replace the fan-out wafer level packages? T Tiedje, S Lüngen, M Schubert, M Luniak, K Nieweglowski, K Bock 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1065-1070, 2017 | 12 | 2017 |
Evaluation of nanoparticle inks on flexible and stretchable substrates for biocompatible application M Schubert, L Rebohle, Y Wang, M Fritsch, K Bock, M Vinnichenko, ... 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-6, 2018 | 8 | 2018 |
Flexible and stretchable redistribution layer with embedded chips for human-machine interface M Schubert, L Wambera, O Mudrievska, K Nieweglowski, J Wagner, ... 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-5, 2020 | 6 | 2020 |
Characterization of polymeric encapsulation for implantable microsystems applying dynamic fluidic and electrical load M Schubert, S Kirsten, T Voitsekhivska, K Bock 2015 38th International Spring Seminar on Electronics Technology (ISSE), 129-133, 2015 | 6 | 2015 |
Screen printed conductive pastes for biomedical electronics H Berg, M Schubert, S Friedrich, K Bock 2016 39th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2016 | 5 | 2016 |
Printed flexible microelectrode for application of nanosecond pulsed electric fields on cells M Schubert, J Rasche, MM Laurila, T Vuorinen, M Mäntysalo, K Bock Materials 12 (17), 2713, 2019 | 4 | 2019 |
3D printed flexible substrate with pneumatic driven electrodes for health monitoring M Schubert, S Friedrich, K Bock, D Wedekind, S Zaunseder, H Malberg 2017 21st European Microelectronics and Packaging Conference (EMPC …, 2017 | 4 | 2017 |
Characterization of ionic permeability and water vapor transmission rate of polymers used for implantable electronics S Kirsten, M Schubert, J Uhlemann, KJ Wolter 2014 36th Annual International Conference of the IEEE Engineering in …, 2014 | 4 | 2014 |
Fluid dynamic load of polymers used as encapsulation material for implantable microsystems S Kirsten, M Schubert, J Uhlemann, KJ Wolter Biomedical Engineering/Biomedizinische Technik 58 (SI-1-Track-C …, 2013 | 3 | 2013 |
Additively manufactured Pneumatically Driven skin electrodes M Schubert, M Schmidt, P Wolter, H Malberg, S Zaunseder, K Bock Materials 11 (1), 19, 2017 | 2 | 2017 |
Package characterization of FET-based biochemical sensors T Voitsekhivska, E Suthau, S Kirsten, M Schubert, F Zörgiebel, G Cuniberti, ... 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 725-729, 2014 | 2 | 2014 |
Evaluation of dispensed carbon nanotube ink on flexible substrates for biocompatible application M Schubert, H Berg, S Friedrich, K Bock 2016 6th Electronic System-Integration Technology Conference (ESTC), 1-5, 2016 | 1 | 2016 |