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Erik Jung
Erik Jung
Fraunhofer IZM, Berlin, Germany
Verified email at izm.fraunhofer.de
Title
Cited by
Cited by
Year
Packaging of bio-MEMS: Strategies, technologies, and applications
T Velten, HH Ruf, D Barrow, N Aspragathos, P Lazarou, E Jung, CK Malek, ...
IEEE Transactions on Advanced Packaging 28 (4), 533-546, 2005
1202005
Reliability assessment of flip-chip assemblies with lead-free solder joints
A Schubert, R Dudek, H Walter, E Jung, A Gollhardt, B Michel, H Reichl
52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002
992002
3-D capacitive interconnections with mono-and bi-directional capabilities
A Fazzi, R Canegallo, L Ciccarelli, L Magagni, F Natali, E Jung, P Rolandi, ...
IEEE Journal of Solid-State Circuits 43 (1), 275-284, 2008
712008
Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology
J Kloeser, K Heinricht, K Kutzner, E Jung, A Ostmann, H Reichl
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998
651998
Method for transfering solder to a device and/or testing the device
K Kaskoun, E Jung, W Budweiser
US Patent 6,409,073, 2002
642002
Reliability issues in Pb-free solder joint miniaturization
Z Huang, PP Conway, E Jung, RC Thomson, C Liu, T Loeher, M Minkus
Journal of electronic materials 35, 1761-1772, 2006
582006
Method for producing encapsulated chips
KF Becker, T Braun, M Koch, A Ostmann, L Böttcher, E Jung
US Patent 7,011,989, 2006
572006
Long term in vitro functional stability and recording longevity of fully integrated wireless neural interfaces based on the Utah Slant Electrode Array
A Sharma, L Rieth, P Tathireddy, R Harrison, H Oppermann, M Klein, ...
Journal of neural engineering 8 (4), 045004, 2011
552011
On-chip automation of cell-free protein synthesis: new opportunities due to a novel reaction mode
V Georgi, L Georgi, M Blechert, M Bergmeister, M Zwanzig, ...
Lab on a Chip 16 (2), 269-281, 2016
542016
3D capacitive interconnections with mono-and bi-directional capabilities
A Fazzi, R Canegallo, L Ciccarelli, L Magagni, F Natali, E Jung, ...
2007 IEEE International Solid-State Circuits Conference. Digest of Technical …, 2007
522007
3-D capacitive interconnections for wafer-level and die-level assembly
A Fazzi, L Magagni, M Mirandola, B Charlet, L Di Cioccio, E Jung, ...
IEEE Journal of Solid-State Circuits 42 (10), 2270-2282, 2007
502007
Realization of a stackable package using chip in polymer technology
A Ostmann, A Neumann, S Weser, E Jung, L Bottcher, H Reichl
2nd International IEEE Conference on Polymers and Adhesives in …, 2002
482002
Stackable system-on-packages with integrated components
KF Becker, E Jung, A Ostmann, T Braun, A Neumann, R Aschenbrenner, ...
IEEE Transactions on Advanced Packaging 27 (2), 268-277, 2004
442004
Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term …
A Sharma, L Rieth, P Tathireddy, R Harrison, H Oppermann, M Klein, ...
Sensors and Actuators A: Physical 188, 167-172, 2012
402012
Low cost bumping by stencil printing: process qualification for 200 μm pitch
J Kloeser, K Heinricht, E Jung, L Lauter, A Ostmann, R Aschenbrenner, ...
Microelectronics Reliability 40 (3), 497-505, 2000
402000
Ultra thin chips for miniaturized products
E Jung, A Ostmann, D Wojakowski, C Landesberger, R Aschenbrenner, ...
Microsystem technologies 9, 449-452, 2003
392003
A new approach to chip size package using meniscus soldering and FPC-bonding
C Kallmayer, E Jung, P Kasulke, R Azadeh, G Azdasht, E Zakel, H Reichl
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998
311998
State-of-the-art of 3D SiP Technology
T Thomas, FY Lin, KF Becker, T Braun, E Jung, R Aschenbrenner, ...
Proceedings of IMAPS Poland 2, 2009
262009
Packaging options for MEMS devices
E Jung
MRS bulletin 28 (1), 51-54, 2003
262003
The biocompatibility of materials used in printed circuit board technologies with respect to primary neuronal and K562 cells
M Mazzuferi, R Bovolenta, M Bocchi, T Braun, J Bauer, E Jung, B Iafelice, ...
Biomaterials 31 (6), 1045-1054, 2010
222010
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