| Additive manufacturing of toroid inductor for power electronics applications Y Yan, J Moss, KDT Ngo, Y Mei, GQ Lu IEEE Transactions on Industry Applications 53 (6), 5709-5714, 2017 | 69 | 2017 |
| Design and additive manufacturing of multipermeability magnetic cores L Liu, C Ding, S Lu, T Ge, Y Yan, Y Mei, KDT Ngo, GQ Lu IEEE Transactions on Industry Applications 54 (4), 3541-3547, 2018 | 51 | 2018 |
| Additive manufacturing of planar inductor for Power Electronics applications Y Yan, C Ding, KDT Ngo, Y Mei, GQ Lu 2016 International Symposium on 3D Power Electronics Integration and …, 2016 | 41 | 2016 |
| Additive manufacturing of magnetic components for power electronics integration Y Yan, KDT Ngo, Y Mei, GQ Lu 2016 International Conference on Electronics Packaging (ICEP), 368-371, 2016 | 32 | 2016 |
| Effect of sintering temperature on magnetic core-loss properties of a NiCuZn ferrite for high-frequency power converters YI Yan, KDT Ngo, D Hou, M Mu, Y Mei, GQ Lu Journal of Electronic Materials 44, 3788-3794, 2015 | 28 | 2015 |
| Additive manufacturing of magnetic components for heterogeneous integration Y Yan, L Liu, C Ding, L Nguyen, J Moss, Y Mei, GQ Lu 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 324-330, 2017 | 20 | 2017 |
| Effects of voids in sintered silver joint on thermal and optoelectronic performances of high power laser diode Y Yan, Y Guan, X Chen, GQ Lu Journal of Electronic Packaging 135 (4), 041003, 2013 | 19 | 2013 |
| Design methodology and materials for additive manufacturing of magnetic components Y Yan Virginia Tech, 2017 | 18 | 2017 |
| UV-assisted 3D-printing of soft ferrite magnetic components for power electronics integration L Liu, T Ge, Y Yan, KDT Ngo, GQ Lu 2017 International Conference on Electronics Packaging (ICEP), 447-450, 2017 | 17 | 2017 |
| Design, fabrication, and characterization of a low-temperature curable magnetic composite for power electronics integration Y Yan, W Sun, S Gao, T Ge, KDT Ngo, GQ Lu IEEE Transactions on Magnetics 54 (1), 1-6, 2017 | 14 | 2017 |
| Over-molded inductor (OMI)—Feasibility demonstration in a DC–DC converter T Ge, Y Yan, GQ Lu, K Ngo IEEE Transactions on Industrial Electronics 64 (7), 5738-5740, 2017 | 14 | 2017 |
| Die bonding of high power 808 nm laser diodes with nanosilver paste Y Yan, X Chen, X Liu, Y Mei, GQ Lu Journal of Electronic Packaging 134 (4), 041003, 2012 | 14 | 2012 |
| Nicuzn ferrite cores by gelcasting: Processing and properties L Liu, Y Yan, KDT Ngo, GQ Lu IEEE Transactions on Industry Applications 53 (6), 5728-5733, 2017 | 11 | 2017 |
| Die bonding of single emitter semiconductor laser with nano-scale silver paste Y Yan, X Chen, XS Liu, GQ Lu 2011 12th International Conference on Electronic Packaging Technology and …, 2011 | 10 | 2011 |
| Printed repassivation for wafer chip scale packaging D Komatsu, M Shibuya, Y Yan, H Nguyen, LT Nguyen, A Poddar US Patent 10,541,220, 2020 | 3 | 2020 |
| Inkjet printed electronic components Y Yan, LT Nguyen, A Prabhu, A Poddar US Patent App. 16/148,981, 2020 | 2 | 2020 |
| Integrated circuit backside metallization H Sada, S Iriguchi, G Yano, LT Nguyen, A Prabhu, A Poddar, Y Yan, ... US Patent 11,367,699, 2022 | 1 | 2022 |
| Method for manufacturing an integrated transformer with printed core piece Y Yan, Z Zhang, Y Sato, K Otake, V Khanolkar US Patent 11,887,776, 2024 | | 2024 |
| Method of manufacturing transformers with laminate windings and build-up films Z Zhang, K Otake, Y Yan, J Morroni, Y Sato, T Ando US Patent 11,869,855, 2024 | | 2024 |
| Integrated circuit with inductor in magnetic package H Inoue, K Otake, Y Sato, T Ando, J Morroni, A Winkler, Y Yan US Patent App. 17/852,979, 2024 | | 2024 |
