| The electrothermal large-signal model of power MOS transistors for SPICE J Zarebski, K Górecki IEEE transactions on power electronics 25 (5), 1265-1274, 2009 | 88 | 2009 |
| Nonlinear compact thermal model of power semiconductor devices K Górecki, J Zarebski IEEE Transactions on Components and Packaging Technologies 33 (3), 643-647, 2010 | 70 | 2010 |
| Compact thermal models of semiconductor devices: A Review K Górecki, J Zarębski, P Górecki, P Ptak International Journal of Electronics and Telecommunications 65, 2019 | 59 | 2019 |
| Modelling mutual thermal interactions between power LEDs in SPICE K Górecki Microelectronics Reliability 55 (2), 389-395, 2015 | 58 | 2015 |
| Parameter estimation of the electrothermal model of the ferromagnetic core K Górecki, M Rogalska, J Zarębski Microelectronics Reliability 54 (5), 978-984, 2014 | 58 | 2014 |
| Measurements of parameters of the thermal model of the IGBT module K Górecki, P Górecki, J Zarębski IEEE Transactions on Instrumentation and Measurement 68 (12), 4864-4875, 2019 | 55 | 2019 |
| Modeling the influence of selected factors on thermal resistance of semiconductor devices K Górecki, J Zarębski IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (3 …, 2013 | 52 | 2013 |
| Nonlinear compact thermal model of the IGBT dedicated to SPICE K Górecki, P Górecki IEEE Transactions on Power Electronics 35 (12), 13420-13428, 2020 | 50 | 2020 |
| Wireless power transfer—A review K Detka, K Górecki Energies 15 (19), 7236, 2022 | 47 | 2022 |
| Modeling nonisothermal characteristics of switch-mode voltage regulators K Gorecki, J Zarebski IEEE Transactions on Power Electronics 23 (4), 1848-1858, 2008 | 45 | 2008 |
| New dynamic electro-thermo-optical model of power LEDs K Górecki, P Ptak Microelectronics Reliability 91, 1-7, 2018 | 42 | 2018 |
| Application of average electrothermal models in the SPICE-aided analysis of boost converters K Górecki, K Detka IEEE Transactions on Industrial Electronics 66 (4), 2746-2755, 2018 | 42 | 2018 |
| The analysis of accuracy of selected methods of measuring the thermal resistance of IGBTs K Górecki, P Górecki Metrology and Measurement Systems 22 (3), 2015 | 42 | 2015 |
| Modelling LED lamps in SPICE with thermal phenomena taken into account K Górecki, P Ptak Microelectronics Reliability 79, 440-447, 2017 | 40 | 2017 |
| The method of a fast electrothermal transient analysis of single-inductance DC–DC converters K Górecki, J Zarębski IEEE Transactions on Power Electronics 27 (9), 4005-4012, 2012 | 40 | 2012 |
| Electrothermal model of a power LED for SPICE K Górecki International Journal of Numerical Modelling: Electronic Networks, Devices …, 2012 | 38 | 2012 |
| Electrothermal model of choking-coils for the analysis of dc–dc converters K Górecki, K Detka Materials Science and Engineering: B 177 (15), 1248-1253, 2012 | 36 | 2012 |
| Modeling single inductor DC–DC converters with thermal phenomena in the inductor taken into account K Detka, K Gorecki, J Zarębski IEEE Transactions on Power Electronics 32 (9), 7025-7033, 2016 | 35 | 2016 |
| A method of measuring the transient thermal impedance of monolithic bipolar switched regulators J Zarebski, K Gorecki IEEE Transactions on Components and Packaging Technologies 30 (4), 627-631, 2007 | 35 | 2007 |
| A new electrothermal average model of the diode–transistor switch K Górecki Microelectronics Reliability 48 (1), 51-58, 2008 | 34 | 2008 |
dr hab. inż. Przemysław Ptak, prof. UMGUniwersytet Morski w GdyniVerified email at we.umg.edu.pl
