Improved-sensitivity resonant electric-field probes based on planar spiral stripline and rectangular plate structure J Wang, Z Yan, W Liu, X Yan, J Fan IEEE Transactions on Instrumentation and Measurement 68 (3), 882-894, 2018 | 46 | 2018 |
Noncontact wideband current probes with high sensitivity and spatial resolution for noise location on PCB Z Yan, W Liu, J Wang, D Su, X Yan, J Fan IEEE Transactions on Instrumentation and Measurement 67 (12), 2881-2891, 2018 | 42 | 2018 |
A high-sensitivity resonant tangential E-probe with loaded improved dipole and embedded integrated balun J Wang, Z Yan, W Liu, D Su, X Yan, J Fan IEEE Transactions on Instrumentation and Measurement 68 (8), 3042-3044, 2019 | 30 | 2019 |
A miniature high-sensitivity active electric field probe for near-field measurement Z Min, Z Yan, W Liu, J Wang, D Su, X Yan IEEE Antennas and Wireless Propagation Letters 18 (12), 2552-2556, 2019 | 28 | 2019 |
MoM-based ground current reconstruction in RFI application Q Huang, L Li, X Yan, B Bae, H Park, C Hwang, J Fan IEEE Transactions on Electromagnetic Compatibility 60 (4), 1121-1128, 2018 | 27 | 2018 |
MoM based current reconstruction using near-field scanning Q Huang, L Li, X Yan, B Bae, H Park, C Hwang, J Fan 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017 | 27 | 2017 |
Characterization of ESD risk for wearable devices J Zhou, K Ghosh, S Xiang, X Yan, A Hosseinbeig, J Lee, D Pommerenke IEEE Transactions on Electromagnetic Compatibility 60 (5), 1313-1321, 2018 | 26 | 2018 |
An ultrawideband electric probe based on U-shaped structure for near-field measurement from 9 kHz to 40 GHz W Liu, Z Yan, J Wang, X Yan, J Fan IEEE Antennas and Wireless Propagation Letters 18 (6), 1283-1287, 2019 | 25 | 2019 |
A novel tangential electric-field sensor based on electric dipole and integrated balun for the near-field measurement covering GPS band J Wang, Z Yan, W Liu, D Su, X Yan Sensors 19 (9), 1970, 2019 | 16 | 2019 |
SNR analysis and optimization in near-field scanning and EMI applications G Maghlakelidze, X Yan, L Guan, S Marathe, Q Huang, B Bae, C Hwang, ... IEEE Transactions on Electromagnetic Compatibility 60 (4), 1087-1094, 2018 | 12 | 2018 |
An ESD demonstrator system for evaluating the ESD risks of wearable devices J Zhou, Z Legenzoff, X Yan, S Yang, S Xiang, S Shinde, J Lee, ... 2017 39th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 1-7, 2017 | 12 | 2017 |
A 20 GHz landing probe design based on pogo-pins X Yan, Y Wang, J ZhOU, T Li, J Fan 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018 | 7 | 2018 |
Optimizing measurement SNR for weak near-field scanning applications L Guan, G Maghlakelidze, X Yan, S Shinde, D Pommerenke 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017 | 5 | 2017 |
A practical simulation flow for singing capacitor based acoustic noise analysis X Yan, S Wu, M Xue, CKB Leung, D Beetner, J Zhang 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2022 | 4 | 2022 |
Investigations into methods to stabilize the spark in air discharge ESD J Zhou, K Zhou, X Yan, L Shen, D Pommerenke, G Luo 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019 | 4 | 2019 |
A methodology for predicting acoustic noise from singing capacitors in mobile devices X Yan, J Zhang, S Wu, MF Xue, CKB Leung, EA MacIntosh, DG Beetner IEEE Transactions on Electromagnetic Compatibility, 2023 | 3 | 2023 |
EMI investigation and mitigation of flexible flat cables and connectors X Yan, C Wu, D Zhang, S Jin, S Wu, J Fan, C Hwang 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 515-519, 2021 | 3 | 2021 |
Investigation and mitigation of radio frequency interference caused by weak grounding of USB type-C receptacle connector A Huang, X Yan, J Sun, Q Huang, J Fan, S Wu, D Zhang, H Liao, S Jin, ... 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 3 | 2020 |
Spatial resolution study for magnetic near-field probe X Yan Missouri University of Science and Technology, 2018 | 3 | 2018 |
Microwave Holography for EMI Source Imaging X Yan, J Li, W Zhang, K Ghosh, P Sochoux, DG Beetner, V Khilkevich IEEE Transactions on Electromagnetic Compatibility, 2023 | 1 | 2023 |