Peter Ramm
Peter Ramm
Head of Strategic Projects at Fraunhofer EMFT
Verified email at
Cited by
Cited by
Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits
P Garrou, C Bower, P Ramm
John Wiley & Sons, 2008
Method of making a three-dimensional integrated circuit
P Ramm, R Buchner
US Patent 5,563,084, 1996
Method of making a three-dimensional integrated circuit
P Ramm, R Buchner
US Patent 5,877,034, 1999
Handbook of Wafer Bonding
P Ramm, JJQ Lu, MMV Taklo
John Wiley & Sons, 2012
Through silicon via technology—processes and reliability for wafer-level 3D system integration
P Ramm, MJ Wolf, A Klumpp, R Wieland, B Wunderle, B Michel, H Reichl
2008 58th Electronic Components and Technology Conference, 841-846, 2008
Three dimensional metallization for vertically integrated circuits: Invited lecture
P Ramm, D Bollmann, R Braun, R Buchner, U Cao-Minh, M Engelhardt, ...
Microelectronic Engineering 37, 39-47, 1997
3D integration technology: Status and application development
P Ramm, A Klumpp, J Weber, N Lietaer, M Taklo, W De Raedt, T Fritzsch, ...
2010 Proceedings of ESSCIRC, 9-16, 2010
Vertical system integration by using inter-chip vias and solid-liquid interdiffusion bonding
A Klumpp, R Merkel, P Ramm, J Weber, R Wieland
Japanese Journal of Applied Physics 43 (7A), L829, 2004
Thermo-mechanical reliability of 3D-integrated microstructures in stacked silicon
B Wunderle, R Mrossko, O Wittler, E Kaulfersch, P Ramm, B Michel, ...
MRS Online Proceedings Library (OPL) 970, 0970-Y02-04, 2006
3D system integration technologies
P Ramm, A Klumpp, R Merkel, J Weber, R Wieland, A Ostmann, J Wolf
MRS Online Proceedings Library (OPL) 766, E5. 6, 2003
Energy Autonomous Wearable Sensors for Smart Healthcare: A Review
AS Dahiya, J Thireau, J Boudaden, S Lal, U Gulzar, Y Zhang, T Gil, ...
Journal of The Electrochemical Society 167, 2020
Thermal analysis of vertically integrated circuits
MB Kleiner, SA Kuhn, P Ramm, W Weber
Proceedings of International Electron Devices Meeting, 487-490, 1995
3D System-on-Chip technologies for More than Moore systems
P Ramm, A Klumpp, J Weber, MMV Taklo
Microsystem technologies 16, 1051-1055, 2010
Interchip via technology for vertical system integration
P Ramm, D Bonfert, H Gieser, J Haufe, F Iberl, A Klumpp, A Kux, ...
Proceedings of the IEEE 2001 International Interconnect Technology …, 2001
Method of vertically integrating electric components by means of back contacting
P Ramm, A Klumpp
US Patent 6,548,391, 2003
Method of making a vertical integrated circuit
P Ramm, R Buchner
US Patent 5,766,984, 1998
Face-to-face chip integration with full metal interface
H Hübner, O Ehrmann, M Eigner, W Gruber, A Klumpp, R Merkel, ...
Advanced Metallization Conference, San Diego 18, 53-58, 2002
Handbook of 3D Integration, Volume 3: 3D Process Technology
P Garrou, M Koyanagi, P Ramm
John Wiley & Sons, 2014
Technologies for 3D wafer level heterogeneous integration
MJ Wolf, P Ramm, A Klumpp, H Reichl
2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 123-126, 2008
Method of vertically integrating microelectronic systems
P Ramm
US Patent 5,851,894, 1998
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