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Arsalan Alam
Tytuł
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Stability and delay analysis of multi-layered GNR and multi-walled CNT interconnects
VR Kumar, MK Majumder, A Alam, NR Kukkam, BK Kaushik
Journal of Computational Electronics 14, 611-618, 2015
552015
Flexible hybrid electronics technology using die-first FOWLP for high-performance and scalable heterogeneous system integration
T Fukushima, A Alam, A Hanna, SC Jangam, AA Bajwa, SS Iyer
IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018
452018
An unconditionally stable FDTD model for crosstalk analysis of VLSI interconnects
VR Kumar, A Alam, BK Kaushik, A Patnaik
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015
452015
Through silicon vias: materials, models, design, and performance
BK Kaushik, VR Kumar, MK Majumder, A Alam
Crc Press, 2016
362016
Expandable Polymer Enabled Wirelessly Destructible High‐Performance Solid State Electronics
A Gumus, A Alam, AM Hussain, K Mishra, I Wicaksono, GA Torres Sevilla, ...
Advanced Materials Technologies 2 (5), 1600264, 2017
272017
Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (< 6 µm) and Reliable Flexible Cu-Based …
A Hanna, A Alam, T Fukushima, S Moran, W Whitehead, SC Jangam, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1505-1511, 2018
262018
“FlexTrate^ TM”—Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP
T Fukushima, A Alam, Z Wan, SC Jangam, S Pal, G Ezhilarasu, A Bajwa, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 649-654, 2017
262017
Performance analysis of single-and multi-walled carbon nanotube based through silicon vias
A Alam, MK Majumder, A Kumari, VR Kumar, BK Kaushik
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1834-1839, 2015
182015
Heterogeneous integration of a fan-out wafer-level packaging based foldable display on elastomeric substrate
A Alam, A Hanna, R Irwin, G Ezhilarasu, H Boo, Y Hu, CW Wong, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 277-282, 2019
162019
A flexible, heterogeneously integrated wireless powered system for bio-implantable applications using fan-out wafer-level packaging
G Ezhilarasu, A Hanna, R Irwin, A Alam, SS Iyer
2018 IEEE International Electron Devices Meeting (IEDM), 29.7. 1-29.7. 4, 2018
162018
A high spatial resolution surface electromyography (sEMG) system using fan-out wafer-level packaging on FlexTrate™
A Alam, M Molter, B Gaonkar, A Hanna, R Irwin, S Benedict, G Ezhilarasu, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 985-990, 2020
132020
Self-assembly technologies for FlexTrate™
T Fukushima, Y Susumago, H Kino, T Tanaka, A Alam, A Hanna, S Iyer
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1836-1841, 2018
72018
Signal integrity improvement with peripherally placed MWCNTs in mixed CNT bundle based TSVs
MK Majumder, A Kumari, A Alam, VR Kumar, BK Kaushik
2015 IEEE International Conference on Electron Devices and Solid-State …, 2015
72015
Flexible heterogeneously integrated low form factor wireless multi-channel surface electromyography (sEMG) device
A Alam, M Molter, A Kapoor, B Gaonkar, S Benedict, L Macyszyn, ...
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1544-1549, 2021
62021
Process Integration for FlexTrateTM
T Fukushima, Y Susumago, H Kino, T Tanaka, A Alam, A Hanna, SS Iyer
2018 International Flexible Electronics Technology Conference (IFETC), 1-2, 2018
32018
Smartphone App-Enabled Flex sEMG Patch using FOWLP
P Venkatesh, R Irwin, A Alam, M Molter, A Kapoor, B Gaonkar, ...
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2263-2268, 2022
22022
Flexible Hybrid Electronics Using Fan‐Out Wafer‐Level Packaging
SS Iyer, A Alam
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for …, 2022
22022
Heterogenous integration of MEMS gas sensor using FOWLP: Personal environment monitors
S Benedict, A Nagarajan, K Thejas, A Alam, MS Illango, G Ezhilarasu, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 824-828, 2020
22020
FlexTrate A Biocompatible Flexible Electronics Platform for High Performance Applications using Fan-Out Wafer-level Packaging
A Hanna, A Alam, G Ezhilarasu, T Fukushima, SS Iyer, ...
University of California Los Angeles Los Angeles United States, 2019
22019
Flexible and stretchable interconnects for flexible systems
SS Iyer, A Alam, A Hanna, T Fukushima
US Patent 11,538,764, 2022
12022
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