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Xin Li
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Pressureless sintering of nanosilver paste at low temperature to join large area (≥ 100 mm2) power chips for electronic packaging
S Fu, Y Mei, GQ Lu, X Li, G Chen, X Chen
Materials Letters 128, 42-45, 2014
952014
Creep properties of low-temperature sintered nano-silver lap shear joints
X Li, G Chen, L Wang, YH Mei, X Chen, GQ Lu
Materials Science and Engineering: A 579, 108-113, 2013
582013
A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air
J Li, X Li, L Wang, YH Mei, GQ Lu
Materials & Design 140, 64-72, 2018
562018
Simplification of low-temperature sintering nanosilver for power electronics packaging
Y Mei, G Chen, Y Cao, X Li, D Han, X Chen
Journal of electronic materials 42 (6), 1209-1218, 2013
512013
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate
SY Zhao, X Li, YH Mei, GQ Lu
Microelectronics Reliability 55 (12), 2524-2531, 2015
472015
Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint
G Chen, ZS Zhang, YH Mei, X Li, DJ Yu, L Wang, X Chen
Mechanics of Materials 72, 61-71, 2014
472014
Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates
Q Xu, Y Mei, X Li, GQ Lu
Journal of Alloys and Compounds 675, 317-324, 2016
452016
Rapid sintering nanosilver joint by pulse current for power electronics packaging
Y Mei, Y Cao, G Chen, X Li, GQ Lu, X Chen
IEEE Transactions on Device and Materials Reliability 13 (1), 258-265, 2013
402013
Reliability evaluation of multichip phase-leg IGBT modules using pressureless sintering of nanosilver paste by power cycling tests
S Fu, Y Mei, X Li, C Ma, GQ Lu
IEEE Transactions on Power Electronics 32 (8), 6049-6058, 2016
382016
Granular activated carbon supported iron as a heterogeneous persulfate catalyst for the pretreatment of mature landfill leachate
Z Li, Q Yang, Y Zhong, X Li, L Zhou, X Li, G Zeng
Rsc Advances 6 (2), 987-994, 2016
382016
Parametric study on pressureless sintering of nanosilver paste to bond large-area (≥ 100 mm2) power chips at low temperatures for electronic packaging
S Fu, Y Mei, X Li, P Ning, GQ Lu
Journal of Electronic Materials 44 (10), 3973-3984, 2015
362015
High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force
X Li, G Chen, X Chen, GQ Lu, L Wang, YH Mei
Microelectronics Reliability 53 (1), 174-181, 2013
352013
Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test
X Li, G Chen, X Chen, GQ Lu, L Wang, YH Mei
Soldering & surface mount technology, 2012
332012
Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging
G Chen, L Yu, YH Mei, X Li, X Chen, GQ Lu
Journal of Materials Processing Technology 214 (9), 1900-1908, 2014
322014
Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature
Y Tan, X Li, X Chen
Microelectronics Reliability 54 (3), 648-653, 2014
322014
Thermo-mechanical reliability of double-sided IGBT assembly bonded by sintered nanosilver
YH Mei, JY Lian, X Chen, G Chen, X Li, GQ Lu
IEEE Transactions on Device and Materials Reliability 14 (1), 194-202, 2013
322013
Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials
X Li, X Chen, GQ Lu
Journal of Electronic Packaging 132, 031011, 2010
322010
Rapid sintering of nano-Ag paste at low current to bond large area (> 100 mm2) power chips for electronics packaging
Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu
Journal of Materials Processing Technology 255, 644-649, 2018
312018
Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications
X Wang, Y Mei, X Li, M Wang, Z Cui, GQ Lu
Journal of Alloys and Compounds 777, 578-585, 2019
302019
Characterization and reliability of sintered nanosilver joints by a rapid current-assisted method for power electronics packaging
YH Mei, Y Cao, G Chen, X Li, GQ Lu, X Chen
IEEE Transactions on Device and Materials Reliability 14 (1), 262-267, 2013
292013
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