| Pressureless sintering of nanosilver paste at low temperature to join large area (≥ 100 mm2) power chips for electronic packaging S Fu, Y Mei, GQ Lu, X Li, G Chen, X Chen Materials Letters 128, 42-45, 2014 | 95 | 2014 |
| Creep properties of low-temperature sintered nano-silver lap shear joints X Li, G Chen, L Wang, YH Mei, X Chen, GQ Lu Materials Science and Engineering: A 579, 108-113, 2013 | 58 | 2013 |
| A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air J Li, X Li, L Wang, YH Mei, GQ Lu Materials & Design 140, 64-72, 2018 | 56 | 2018 |
| Simplification of low-temperature sintering nanosilver for power electronics packaging Y Mei, G Chen, Y Cao, X Li, D Han, X Chen Journal of electronic materials 42 (6), 1209-1218, 2013 | 51 | 2013 |
| Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate SY Zhao, X Li, YH Mei, GQ Lu Microelectronics Reliability 55 (12), 2524-2531, 2015 | 47 | 2015 |
| Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint G Chen, ZS Zhang, YH Mei, X Li, DJ Yu, L Wang, X Chen Mechanics of Materials 72, 61-71, 2014 | 47 | 2014 |
| Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates Q Xu, Y Mei, X Li, GQ Lu Journal of Alloys and Compounds 675, 317-324, 2016 | 45 | 2016 |
| Rapid sintering nanosilver joint by pulse current for power electronics packaging Y Mei, Y Cao, G Chen, X Li, GQ Lu, X Chen IEEE Transactions on Device and Materials Reliability 13 (1), 258-265, 2013 | 40 | 2013 |
| Reliability evaluation of multichip phase-leg IGBT modules using pressureless sintering of nanosilver paste by power cycling tests S Fu, Y Mei, X Li, C Ma, GQ Lu IEEE Transactions on Power Electronics 32 (8), 6049-6058, 2016 | 38 | 2016 |
| Granular activated carbon supported iron as a heterogeneous persulfate catalyst for the pretreatment of mature landfill leachate Z Li, Q Yang, Y Zhong, X Li, L Zhou, X Li, G Zeng Rsc Advances 6 (2), 987-994, 2016 | 38 | 2016 |
| Parametric study on pressureless sintering of nanosilver paste to bond large-area (≥ 100 mm2) power chips at low temperatures for electronic packaging S Fu, Y Mei, X Li, P Ning, GQ Lu Journal of Electronic Materials 44 (10), 3973-3984, 2015 | 36 | 2015 |
| High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force X Li, G Chen, X Chen, GQ Lu, L Wang, YH Mei Microelectronics Reliability 53 (1), 174-181, 2013 | 35 | 2013 |
| Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test X Li, G Chen, X Chen, GQ Lu, L Wang, YH Mei Soldering & surface mount technology, 2012 | 33 | 2012 |
| Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging G Chen, L Yu, YH Mei, X Li, X Chen, GQ Lu Journal of Materials Processing Technology 214 (9), 1900-1908, 2014 | 32 | 2014 |
| Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature Y Tan, X Li, X Chen Microelectronics Reliability 54 (3), 648-653, 2014 | 32 | 2014 |
| Thermo-mechanical reliability of double-sided IGBT assembly bonded by sintered nanosilver YH Mei, JY Lian, X Chen, G Chen, X Li, GQ Lu IEEE Transactions on Device and Materials Reliability 14 (1), 194-202, 2013 | 32 | 2013 |
| Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials X Li, X Chen, GQ Lu Journal of Electronic Packaging 132, 031011, 2010 | 32 | 2010 |
| Rapid sintering of nano-Ag paste at low current to bond large area (> 100 mm2) power chips for electronics packaging Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu Journal of Materials Processing Technology 255, 644-649, 2018 | 31 | 2018 |
| Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications X Wang, Y Mei, X Li, M Wang, Z Cui, GQ Lu Journal of Alloys and Compounds 777, 578-585, 2019 | 30 | 2019 |
| Characterization and reliability of sintered nanosilver joints by a rapid current-assisted method for power electronics packaging YH Mei, Y Cao, G Chen, X Li, GQ Lu, X Chen IEEE Transactions on Device and Materials Reliability 14 (1), 262-267, 2013 | 29 | 2013 |
GQ Lu or Guo-Quan Lu or G-Q LuVirginia Tech ECE and MSEZweryfikowany adres z vt.edu
